May 21, 2014 – The rackmount data centre (RDC) panel series from Tii Network Technologies is composed of high density patch panels and splice bays.

The modular stackable panels allow for flexible deployment, future expansion, and mixture of fusion splicing, preterminated cable assemblies and MTP/MPO based plug and play solutions, says the company. Compatible with 19-in. or 23-in. racks, the panels are available with factory loaded pigtails and splice trays.